SINGAPORE, Aug. 29, 2024 /PRNewswire/ -- Smartee organized the GS Mandibular Repositioning Therapy Conference in Singapore, gathering top dental professionals from across Singapore, Australia, Malaysia, and the Philippines.
The conference was led by orthodontic experts, including Prof. Gang Shen, Chief Orthodontist at Taikang Bybo Dental and Smartee's Chief Scientist in R&D, along with Dr. Jingting Lu, a core member of Prof. Shen's orthodontic team. Together, they unveiled insights into the application of Smartee GS Technology for treating malocclusion, with a focus on facial concavity—a condition that has long posed challenges in the orthodontic community.
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SINGAPORE, Aug. 29, 2024 /PRNewswire/ -- Smartee organized the GS Mandibular Repositioning Therapy Conference in Singapore, gathering top dental professionals from across Singapore, Australia, Malaysia, and the Philippines.
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Innovative Solutions for Complex Orthodontic Challenges
Prof. Shen introduced an original clinical system to classify malocclusions based on patients' facial profiles and a predictive growth model for facial concavity (Class III malocclusion), emphasizing the complexities of this condition. Unlike facial convexity, facial concavity presents more severe jaw discrepancies and dynamic changes in malocclusion, making accurate growth predictions challenging. However, through mandibular morphology analysis, Prof. Shen demonstrated how Smartee Mandibular Repositioning Technology can predict treatment outcomes. His approach identifies mandibular shapes—ranging from flat rectangular, which offers a better prognosis, to triangular shapes with varying degrees of concavity, where the prognosis becomes increasingly challenging.
This work not only provides a foundation for developing effective treatment plans, but also enables assessment of the need for additional interventions such as tooth extractions or surgery.
A New Era in Non-Invasive Orthodontic Treatment
Dr. Jingting Lu further highlighted the clinical advantages of Smartee GS aligners, presenting case studies that underscore its effectiveness. She detailed how this technology allows for precise diagnostic and treatment processes, offering a new approach to orthodontic and orthopedic corrections without the need for invasive surgery.
Global Impact and Future Vision
One participant remarked, "Prof. Shen's innovative classification system and the mandibular repositioning technology developed with Smartee address critical clinical challenges, especially in cases involving TMJ malocclusion. This technological system gives me new confidence in tackling real-world clinical issues."
Smartee Dental continues to earn international acclaim for its work in treatment plan design and invisible orthodontic solutions. As the company looks to the future, it remains committed to driving the global advancement of invisible orthodontic technology, delivering high-quality, innovative solutions and products to doctors and patients around the world.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
Smartee Hosts Breakthrough GS Mandibular Repositioning Therapy Conference in Singapore
SAN JOSE, Calif., Sept. 14, 2024 /PRNewswire/ -- From September 10-12, 2024, MSquare Technology made a standout appearance at the highly anticipated AI Hardware & Edge AI Summit in San Jose. With 1,500+ attendees and 75+ stellar speakers from the industry leaders, the summit provided MSquare, a leading provider of semiconductor IP and Chiplet solutions, a key platform to showcase its latest products, highlighted its role in driving innovation within the AI ecosystem through practical case studies and proven results.
Pushing the Boundaries: Innovation-Driven and Shaping the Future
At the forefront of innovation in interconnect IP and Chiplet solutions, MSquare continues to break new ground. MSquare's IO Die ML100, is a leading high-bandwidth memory solution. With its integrated high-efficiency Die-to-Die interconnect IP and support for the UCIe 1.1 protocol, the IO Die ML100 enables ultra-fast data transfer and low-latency inter-chip communication, drastically enhancing the efficiency of AI model training and inference, propelling advancements in AI development.
The IO Die ML100, with its high-speed HBM3 memory subsystem, offers a maximum bandwidth of 819.2 GB/s and supports a transfer rate of 6400 Mbps, adhering to the standard HBM3 JESD238 protocol. It meets the stringent demands for high bandwidth and low power consumption in AI applications, laying a solid foundation for future advancements in AI technology.
Diverse Product Portfolio: Setting the Standard for Innovation
MSquare has built a comprehensive and robust IP product portfolio, cementing its role as a key player in the development of cutting-edge IP infrastructure. Its extensive range of IP products has been validated and mass-produced across a wide spectrum of process nodes, from 5nm to 180nm, supporting over 400 different process technologies at the world's 5 leading foundries.
MSquare's portfolio includes high-speed interconnect IPs such as HBM, LPDDR, ONFI, UCIe, eDP, PCIe, and USB, as well as advanced Chiplet solutions like the M2LINK platform. Together, these offerings form a powerful and open ecosystem that supports digital transformation and drives innovation across industries, from AI and data centers to automotive, IoT, and consumer electronics.
Global Expansion: Building an Ecosystem of Innovation
MSquare is accelerating its global expansion, establishing strategic hubs in San Jose, Sydney, and Tokyo to foster deeper collaboration and strengthen its position in the global AI and semiconductor ecosystems. The AI Hardware & Edge AI Summit offered MSquare an invaluable opportunity to not only demonstrate its technological prowess but also foster collaboration with industry leaders across the AI hardware landscape. MSquare is committed to working alongside global partners to tackle the opportunities and challenges of the AI era, shaping the future of the industry together.
Looking Ahead: A New Era of AI Innovation
As AI and edge computing technologies continue to evolve at breakneck speed, MSquare remains steadfast in its mission to lead the charge in interconnect IP and Chiplet innovation. Through its participation in this summit, MSquare has showcased its unwavering commitment to pushing technological boundaries and driving the future of AI. MSquare looks forward to continuing its collaboration with industry peers to explore new possibilities and to create the next era of AI advancements.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit