LG ESTABLISHES NEW CONSORTIUM IN HARBIN, COMPLETING ITS GLOBAL HEAT PUMP R&D NETWORK

Partnership to Enhance Company's High-performance Heat Pump Solutions for Cold Climates, Lay Groundwork for the Development of Next-generation Technologies

SEOUL, South Korea, Sept. 3, 2024 /PRNewswire/ -- LG Electronics (LG) is completing its global R&D triangle with the establishment of the Chinese Consortium for Advanced Heat Pump Research (CCAHR) in Harbin. The consortium, which joins existing LG-led initiatives in North America and Europe, will develop next-generation core technologies for heating, ventilation and air conditioning (HVAC) solutions capable of providing strong, dependable performance in extreme cold conditions.

To mark the official launch of CCAHR, LG held a signing ceremony on August 31 (local time) at Harbin Institute of Technology in Harbin, China. Prominent members of the consortium include the Harbin Institute of Technology (HIT), Shanghai Jiao Tong University (SJTU) and Xi'an Jiao Tong University (XJTU), all of which are actively researching HVAC technologies and systems designed for cold climates. The consortium will operate new research facilities in Harbin and Mohe City to develop strong and reliable HVAC solutions, helping LG to deliver products customized to local needs, and strengthen its presence in the Chinese market.

Harbin, known for its harsh winter conditions, and Mohe, where temperatures can drop to below minus 50 degrees Celsius, provide ideal settings for advancing LG's research into heat pump technologies that can maintain high efficiency in severely cold climates. CCHAR will conduct tests on the company's HVAC solutions, including residential air conditioners, at two facilities: a university-owned building at the Harbin Institute of Technology campus, and a residential site in Mohe. The consortium will gather comprehensive operational data to improve the heating performance, energy efficiency and overall reliability of LG's HVAC products.

CCAHR is a significant addition to LG's growing international program of heat pump R&D collaboration, complementing LG-led consortiums established in Korea and the U.S. last November, and in Europe this June. With its trio of consortiums, LG has built a robust R&D infrastructure spanning North America, Europe and Asia, and will be able to develop technologies suited to the unique demands of each region's climatic and housing conditions. The R&D triangle will play a major role in further solidifying the company's global leadership in HVAC technology.

Moreover, during a recent CEO-led investor forum, LG outlined four key strategies for business portfolio innovation, including the acceleration of its B2B capabilities – particularly in the area of HVAC. By leveraging its advanced inverter, heat pump, and chiller technologies, LG aims to lead the market in high-efficiency HVAC solutions, while actively targeting the growing demand for cooling systems, especially in AI data centers.

Additionally, in key markets, LG's HVAC business is establishing a locally self-sufficient operation system encompassing the in-house production of core components and the creation of production bases optimized for regional supply. This system, which covers everything from R&D to sales and maintenance, greatly enhances LG's B2B capabilities and is expected to support meaningful long-term growth.

"We are committed to developing next-generation heat pump technologies tailored to diverse climates," said James Lee, head of the Air Solution Business Unit at LG Electronics Home Appliance & Air Solution Company. "Through our R&D initiatives, we will strengthen our ability to provide differentiated solutions for each region, and reinforce our product and technology leadership in the global HVAC market."

About LG Electronics Air Solution Business Unit

LG air conditioning provides optimized solutions for every sector and climate with a wide range of cutting-edge systems that bring exceptional heating, ventilation and air conditioning performance to buildings worldwide. Through our unmatched expertise and industry knowledge, we respond directly to the needs of businesses seeking digitalized and HVAC solutions. We are the partner your business has been looking for, and are well prepared to integrate our leading technology into your day-to-day operations, supporting you and your business every step of the way. For more information, please visit www.lg.com/global/business/hvac.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

LG ESTABLISHES NEW CONSORTIUM IN HARBIN, COMPLETING ITS GLOBAL HEAT PUMP R&D NETWORK

LG ESTABLISHES NEW CONSORTIUM IN HARBIN, COMPLETING ITS GLOBAL HEAT PUMP R&D NETWORK

LG ESTABLISHES NEW CONSORTIUM IN HARBIN, COMPLETING ITS GLOBAL HEAT PUMP R&D NETWORK

LG ESTABLISHES NEW CONSORTIUM IN HARBIN, COMPLETING ITS GLOBAL HEAT PUMP R&D NETWORK

SAN JOSE, Calif., Sept. 15, 2024 /PRNewswire/ -- From September 10-12, 2024, MSquare Technology made a standout appearance at the highly anticipated AI Hardware & Edge AI Summit in San Jose. With 1,500+ attendees and 75+ stellar speakers from the industry leaders, the summit provided MSquare, a leading provider of semiconductor IP and Chiplet solutions, a key platform to showcase its latest products, highlighted its role in driving innovation within the AI ecosystem through practical case studies and proven results.

Pushing the Boundaries: Innovation-Driven and Shaping the Future

At the forefront of innovation in interconnect IP and Chiplet solutions, MSquare continues to break new ground. MSquare's IO Die ML100, is a leading high-bandwidth memory solution. With its integrated high-efficiency Die-to-Die interconnect IP and support for the UCIe 1.1 protocol, the IO Die ML100 enables ultra-fast data transfer and low-latency inter-chip communication, drastically enhancing the efficiency of AI model training and inference, propelling advancements in AI development.

The IO Die ML100, with its high-speed HBM3 memory subsystem, offers a maximum bandwidth of 819.2 GB/s and supports a transfer rate of 6400 Mbps, adhering to the standard HBM3 JESD238 protocol. It meets the stringent demands for high bandwidth and low power consumption in AI applications, laying a solid foundation for future advancements in AI technology.

Diverse Product Portfolio: Setting the Standard for Innovation

MSquare has built a comprehensive and robust IP product portfolio, cementing its role as a key player in the development of cutting-edge IP infrastructure. Its extensive range of IP products has been validated and mass-produced across a wide spectrum of process nodes, from 5nm to 180nm, supporting over 400 different process technologies at the world's 5 leading foundries.

MSquare's portfolio includes high-speed interconnect IPs such as HBM, LPDDR, ONFI, UCIe, eDP, PCIe, and USB, as well as advanced Chiplet solutions like the M2LINK platform. Together, these offerings form a powerful and open ecosystem that supports digital transformation and drives innovation across industries, from AI and data centers to automotive, IoT, and consumer electronics.

Global Expansion: Building an Ecosystem of Innovation

MSquare is accelerating its global expansion, establishing strategic hubs in San Jose, Sydney, and Tokyo to foster deeper collaboration and strengthen its position in the global AI and semiconductor ecosystems. The AI Hardware & Edge AI Summit offered MSquare an invaluable opportunity to not only demonstrate its technological prowess but also foster collaboration with industry leaders across the AI hardware landscape. MSquare is committed to working alongside global partners to tackle the opportunities and challenges of the AI era, shaping the future of the industry together.

Looking Ahead: A New Era of AI Innovation

As AI and edge computing technologies continue to evolve at breakneck speed, MSquare remains steadfast in its mission to lead the charge in interconnect IP and Chiplet innovation. Through its participation in this summit, MSquare has showcased its unwavering commitment to pushing technological boundaries and driving the future of AI. MSquare looks forward to continuing its collaboration with industry peers to explore new possibilities and to create the next era of AI advancements.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit