MILPITAS, Calif., Oct. 16, 2024 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) introduced the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA's combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications.
Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage KLA's solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall proï¬tability.
KLA's comprehensive portfolio of direct imaging (DI), defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow.
KLA's portfolio includes multiple direct imaging solutions supporting a range of customer lithography requirements. Market adoption of the Corusâ„¢ direct imaging platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high-density interconnect (HDI), the capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies.
For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography. KLA is introducing the new Serenaâ„¢ direct imaging platform for quality, finer line patterning of large-sized, high layer count organic substrates for increased accuracy and yield with the efficiency of a flexible digital solution.
Luminaâ„¢, KLA's new inspection and metrology system for advanced IC substrates (including glass core) and panel-based interposers, enables high-sensitivity detection and scanning metrology at optimized cost of ownership. The system delivers monitoring paired with AI-based review and classification for an actionable defect Pareto chart without the need for operator input, as well as a seamless integration with KLA's copper shaping solutions.
The portfolio is strengthened with proven KLA process control solutions featuring the Orbotech Ultra PerFixâ„¢, EcoNetâ„¢, Zetaâ„¢-6xx, ICOSâ„¢ T890, Quali-Fill® Libra® and QualiLab® Elite product lines. KLA's Frontline software solutions span engineering, computer-aided manufacturing (CAM) and production data analytics to centralize and apply intelligence throughout IC substrate manufacturing, building on KLA's longtime leadership in yield management.
"With today's portfolio news, KLA is affirming our leadership in semiconductor ecosystem innovation," said Oreste Donzella, executive vice president and chief strategy officer, KLA Corporation. "IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow's high-performance chips, and KLA is collaboratively engaged with customers in solving complex production challenges to maximize their yield and business success."
For more information about KLA's comprehensive portfolio of IC substrate solutions, join us at the upcoming TPCA tradeshow.
About KLA
KLA Corporation ("KLA") develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Investors and others should note that KLA announces material financial information including SEC filings, press releases, public earnings calls and conference webcasts using an investor relations website (ir.kla.com). Additional information may be found at: www.kla.com.
Forward-Looking Statements
Statements in this press release other than historical facts, such as statements regarding the expected performance of the IC substrate product portfolio are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technology challenges or limitations that affect the implementation, performance or use of KLA's products, and other risk factors included in KLA's annual report on Form 10-K for the year ended June 30, 2024 and other filings by KLA with the Securities and Exchange Commission (including, without limitation, the risk factors described therein). KLA assumes no obligation to, and do not currently intend to, update these forward-looking statements.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
DUBAI, UAE, Oct. 16, 2024 /PRNewswire/ -- With the theme Accelerate Industrial Digitalization and Intelligence, Huawei, as a Diamond Sponsor, is participating in the GITEX GLOBAL 2024. Huawei hosted the Industrial Digital and Intelligent Transformation Summit and launched joint solutions with partners for ten industries, and a series of new flagship products, which are designed to support customers in enhancing digital and intelligent transformation.
Innovating Nonstop to Help Customers Succeed, Enable Local Partners, and Cultivate Local Talent
Li Peng, Corporate Senior Vice President, President of ICT Sales & Service, Huawei, delivered opening remarks at the summit. "We're combining our strengths in networking, storage, computing, cloud, and energy," said Li, "and we're working with partners to build new digital and intelligent infrastructure."
Li detailed how Huawei has since put reference architecture for the intelligent transformation of industries into practice to provide customers with leading and adaptable solutions.
These achievements would be impossible without our partners", Li continued. " We're committed to building a healthy, open, and mutually beneficial partner ecosystem. We have also established 14 OpenLabs worldwide to support joint innovation with local solution partners.
Li described how Huawei is innovating nonstop to provide partners with lightweight solutions, marketable products, end-to-end business enablement services, and efficient digital platforms to help them serve SMEs more independently, easily, and effectively.
He concluded by describing Huawei's efforts to help develop local digital talent and develop the industry ecosystem, which is key to promoting sustainable development. " Huawei is ready and willing to join forces with more customers and partners to enable industrial digital and intelligent transformation and bring more benefits to the lives and work of people around the world," Li added.
Accelerating Industrial Digitalization and Intelligence for a Leap in Productivity
During his keynote speech, Leo Chen, Corporate Senior Vice President and President of Enterprise Sales, Huawei, emphasized that AI and 5G-A are among the next-gen technologies driving the fourth industrial revolution, which will lead to a significant leap in productivity. However, this transformation also brings challenges in infrastructure, industrial applications, and talent ecosystems. Huawei is committed to utilizing its unique advantages to help customers and partners succeed in the intelligent era.
Huawei will continue to leverage its full-stack capabilities in connectivity, storage, computing, and cloud to assist industries in building AI-ready ICT infrastructure.
Huawei has published the Amplifying Industrial Digitalization & Intelligence Practice White Paper, which includes more than 100 success stories for customers to reference during their own transformation.
Huawei plans to strengthen Huawei-Partner cooperation system and cultivate a digital and intelligent talent ecosystem. Huawei has developed a new Global Digital Index (GDI) with IDC to offer customers quantitative evaluation indicators for transformation.
Building Next-Gen ICT Infrastructure
David Shi, Vice President of ICT Marketing and Solution Sales, Huawei, emphasized the importance of building a solid ICT infrastructure for enterprises to succeed in the intelligent era. He highlighted two key points to expedite this transformation: accelerating the popularization of ICT infrastructure and accelerating monetization. "Only by working closely with our customers and partners can we truly bring intelligence to all industries. " said Shi.
Accelerating the popularization of ICT infrastructure enables more partners and customers to seamlessly integrate, access, and use ICT infrastructure, allowing it to evolve alongside business needs. Huawei has proposed four principles to simplify building and using ICT infrastructure: easy to integrate, access, use, and evolve. These facilitate the widespread use of ICT infrastructure in usual scenarios like campuses, WANs, and data centers.
Huawei has released flagship products and portfolios and developed HUAWEI eKit products, which act as a powerful tool for digital transformation by enabling more efficient integration and usage.
Accelerating monetization means speeding up service innovation and value creation through technologies, integrating technologies and scenarios, and collaborating to build a thriving partner ecosystem that supports continuous enterprise growth.
Huawei worked with partners to unveil digital and intelligent transformation solutions for ten industries, including National Government Cloud Solution, ICT Talent Cultivation Solution,etc.
Grow Together, Win in the Intelligent Era
Huawei's "SHAPE" framework supports partners in 5 key areas: sustaining the leadership, honing joint innovation with partners, advancing partner capability development, promoting partner cooperation experience, and expanding partner growth opportunities.
"We work with our partners to build a customer-centric culture, keep the principle of 'shared benefits as the bridge, integrity as the foundation, and rules as the guarantee', foster a healthy business environment, and grow together to help customers successfully embark on digital and intelligent transformation," said Ernest Zhang, President of Global Partner, Commercial & Distribution, Enterprise Sales, Huawei.
"Collaborating with Huawei means more growth opportunities, higher operation efficiency, greater business margin and stronger AI-ready capability," said Zhang.
Please visit https://e.huawei.com/ae/events/branding/gitex.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
GITEX GLOBAL 2024: Huawei launches a series of industrial digital and intelligent transformation solutions, and flagship products
GITEX GLOBAL 2024: Huawei launches a series of industrial digital and intelligent transformation solutions, and flagship products
GITEX GLOBAL 2024: Huawei launches a series of industrial digital and intelligent transformation solutions, and flagship products
