LAS VEGAS, Jan. 9, 2025 /PRNewswire/ -- From January 7th to 10th, BICV Technology Co., Ltd. (BICV) made its debut at CES 2025. BICV showcased over 30 self-developed products in Intelligent Cockpit Domain, Intelligent Driving Domain, Cockpit-Driving Fusion Domain, and Telematics & Communication. Ranging from mass-produced items to cutting-edge innovations, these products spotlighted BICV's leading position in auto intelligent connected. This appearance at CES heralded a new phase of its international expansion.
In this exhibition, BICV launched products such as the MARS Series Intelligent Cockpit, IntelliDrive 2.0 Cockpit-Driving Fusion Domain Controller, CMS Electronic Exterior Mirror, Driving-Parking Fusion Domain Controller, 5G+V2X+High Precision Navigation Controller, Smart Antenna, 4G/5G T-BOX, and ECALL - BOX. Among them, the SA8775 - based IntelliDrive 2.0 Cockpit-Driving Fusion Domain Controller demonstrates BICV's technological innovation strength in cross - domain fusion.IntelliDrive 2.0 enhances system synergy and performance, enables high - level functions like high - speed NOA, MNP Memory Driving, and HPA Memory Parking, and optimizes the driving experience.
The MARS 06 Intelligent Cockpit, based on the MT8678 platform, can achieve a full - scene 3D interactive interface and drive four screens simultaneously. Its high computing power enables natural human - machine interaction functions. It integrates functions such as IVI, instrument panel, AVM, DMS, IMS, AI large models, and APA. The infrared night - vision product, developed in collaboration with Pioneer, supports the expansion of multiple product categories and can achieve DMS/IMS functions. The Acute 2.0 CMS features high image quality, low power consumption, and low latency. With strong engineering capabilities, it integrates ISP tuning and algorithm integration.
Drawing on project - development experience, BICV has successfully launched many cockpit - domain and other intelligent - connected projects based on platforms such as Qualcomm and MTK, winning global automotive customers' positive recognition. In 2024, BICV witnessed a remarkable overseas sales surge. Some cockpit products passed AA/CA certification and are exported to Europe and North America. It has also entered Middle - East, Southeast - Asian and other overseas markets. With a factory in Thailand, an office in Japan, and expanded business in Germany and South Korea, BICV's overseas reach now spans over 10 countries and regions.
BICV, as a technology innovation company with rich experience and strong development potential in the auto intelligent connected industry, will meet global market needs, break tech boundaries, and offer consumers worldwide more convenient, comfortable, and intelligent travel experiences.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
BICV's Debut at CES 2025: Showcasing Full-Stack, All-Domain Products on the International Stage
Completely Upgraded Servers with the New Intel® Xeon® 6900 Series Processors with P-Cores Optimized for Maximum Performance are Now Shipping in Volume, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and the Industry's Leading Direct-to-Chip Liquid Cooling Solutions
SAN JOSE, Calif., Jan. 9, 2025 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.
"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions® design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."
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There are currently several X14 systems available to customers for remote testing and validation via Supermicro's JumpStart program.
The Supermicro X14 systems are available in a variety of form factors, each optimized for a range of performance-intensive workloads:
These models leverage shared components to increase efficiency and can be fitted with direct-to-chip liquid cooling for maximum performance density.
Supermicro's max-performance X14 systems support the Intel Xeon 6900 series processors with P-cores, which feature up to 128 performance cores per CPU, support for high bandwidth MRDIMMs up to 8800 MT/s, and built-in accelerators including the AI-specific Intel AMX.
The X14 systems represent the perfect building blocks for data centers at any scale, with Supermicro able to provide complete rack-level integration services including design, building, testing, validation, and delivery. An industry-leading global manufacturing capacity of up to 5,000 racks per month (2,000 liquid cooled) and extensive testing and burn-in facilities allow Supermicro to deliver solutions at any scale in a matter of weeks, not months. With Supermicro's complete in-house liquid-cooled direct-to-chip cold plate solutions, liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments. These turn-key solutions include the rack, cabling, power, and cooling infrastructure to simplify solution deployment at scale.
To maximize the performance and density potential of the latest X14 systems, Supermicro also offers complete in-house developed liquid cooling solutions including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments.
Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include:
GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis or edge-optimized 3U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads.
Intel® Gaudi® 3 AI Accelerators – Supermicro is now shipping the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. Designed to increase the efficiency and lower the cost of large-scale AI model training and AI inferencing, the system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs.
SuperBlade® – Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.
FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node.
Hyper – X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
