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CELEBRATING SONGKET IN THE UNITED STATES

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CELEBRATING SONGKET IN THE UNITED STATES
Business

Business

CELEBRATING SONGKET IN THE UNITED STATES

2024-10-01 22:00 Last Updated At:22:15

WASHINGTON, Oct. 1, 2024 /PRNewswire/ -- Songket, Malaysia's prized traditional textile, will take center stage at the Malaysia Day celebrations at the Embassy in Washington, D.C.

In an effort to showcase the beauty of the handwoven Songket to a global audience, the Embassy has organized an exciting program for an event called Songket Malaysia Day. This event will feature an exhibition, a fashion show, and demonstrations of Songket weaving.

The Ambassador of Malaysia to the United States, His Excellency Dato' Seri Mohamed Nazri Abdul Aziz, stated that he specifically chose to promote Songket to mark the 61st Malaysia Day so that guests would have the opportunity to appreciate the artistry of this luxurious handicraft.

This initiative is undoubtedly inspired by UNESCO's recognition of Malaysian Songket. In 2021, UNESCO included Songket in its Intangible Cultural Heritage of Humanity List to be safeguarded.

"Besides honoring our heritage, I also wish to promote cultural exchange and understanding between Malaysia and the United States," said Nazri Aziz. "My hope is that it will attract global interest in our traditional textiles and facilitate their entry into a wider market."

The two-week celebration will commence with The Magnificent Golden Threads of Songket Fashion Show and the official launch of Songket Malaysia Day Exhibition on October 10th, followed by a reception for invited guests at the Malaysian Embassy. His Royal Highness Tengku Muhammad Fakry Petra ibni Almarhum Sultan Muhammad Petra, the Crown Prince of Kelantan, Malaysia, will also be present to officiate and support Songket Malaysia in Washington, D.C.

The fashion show will feature creations by renowned Malaysian designer Sharifah Kirana and emerging young designer Zachrin Jaafars. The collections will embody the exquisite patterns and rich hues of Songket. Their designs celebrate traditional craftsmanship while emanating a regal sophistication, offering a distinguished and elegant reinterpretation of this timeless textile.

Songket textiles from Malaysia's National Textiles Museum will also be on display. Several artists and artisans will be flown to Washington for the launch. Among them is Adiguru Hajah Kelthom Hussein, the proprietor of Che Minah Songket, who will demonstrate the art of Songket weaving. The exhibition will be open to the public from October 11 to 25, 2024.

Furthermore, art enthusiasts will have the opportunity to experience a live demonstration of mural painting by artist Dani Omar, who works with mixed media. His Songket-inspired paintings, including hyper realistic works that bring Songket to life, and Sharifah Kirana's sustainable masterpieces using remnants from her collections will also be on exhibit.

"My heart brims with pride at the sight of the Malaysian Songket being displayed for the world to see. I encourage everyone to visit the exhibition and experience the rich tapestry of our traditional fabric," said Nazri Aziz.

Prior to the exhibition, a one-hour hybrid lecture and presentation on Songket will be held on October 3, 2024, at George Washington University (GWU). The Embassy will open its doors to the public for the exhibition at 3516 International Court, N.W., Washington, D.C., from October 11 to 25, 2024, from 2:00 to 4:00 PM.

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

CELEBRATING SONGKET IN THE UNITED STATES

CELEBRATING SONGKET IN THE UNITED STATES

New Report from SEMI, TECHCET and TechSearch International Highlights Growth Drivers through 2028

MILPITAS, Calif., Oct. 1, 2024 /PRNewswire/ -- Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced today in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.

The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.

"After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024," said Lita Shon-Roy, TECHCET President and CEO. "The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028."

"Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth," said Jan Vardaman, President of TechSearch International. "The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively."

The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials.

Features of the report include:

For more information on the report or to subscribe, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at mktstats@semi.org.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Samer Bahou/SEMI Communications
Phone: 1.408.943.7870
Email: sbahou@semi.org 

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

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