LAS VEGAS, Jan. 9, 2025 /PRNewswire/ -- P&R Measurement, a key player in the measurement and control industry, is making its global debut at the highly anticipated CES 2025, showcasing its breakthrough solutions in AI-driven industrial applications and flexible manufacturing at the world's most powerful technology event. Highlighting its upgraded brand vision, "Empowering everyone to be an innovator," the company emphasizes its dual focus on "AI-enhanced industrial applications + flexible manufacturing solutions" for modern industrial needs.
Since its founding in 2011, P&R Measurement has transformed from a TMC (Test/Measurement/Control) design company into a comprehensive solutions provider, continuously driving advancements in technological innovation and market leadership. In 2023, the company introduced the groundbreaking PRIME, a transformative AI Agent that exemplifies its forward-thinking vision. At CES 2025, PRIME, along with a full lineup of featured products, is highlighting P&R Measurement's robust technological foundation and new directions for industrial manufacturing to a global audience.
PRIME Makes Its Global Debut: Empowering the Future with Industrial AI
PRIME, P&R Measurement's self-developed industrial AI Agent, is the centerpiece of its CES 2025 showcase. PRIME integrates industry testing and manufacturing processes with advanced AI intelligence and automation capabilities, simplifying engineering workflows and reducing technical barriers. It empowers non-expert users to confidently tackle complex engineering tasks.
P&R Measurement envisions its AI applications as a transformative force, advancing industrial manufacturing and services through innovations. By leveraging AI, the company aims to deliver greater value to clients while unlocking new opportunities for business growth.
Lei Wang, founder and chairman of P&R Measurement, emphasized AI's role in reshaping the global manufacturing landscape:
"With the rapid development of AI technology, we are at an unprecedented turning point. AI bridges the gap between upstream suppliers and consumer endpoints in manufacturing. By integrating cross-industry technologies and ideas, we aim to empower customers to drive innovation. This approach addresses the growing demand for personalized and efficient production."
"Our focus is on deeply integrating advanced AI, information technology, and testing, measurement, and control systems to address long-standing challenges in industrial testing and automation, improving intelligence and efficiency," Lei further explained. "We also prioritize flexible manufacturing to reduce the gap between consumers and production, lowering costs in the CTM (Customer-to-Manufacturer) model. Additionally, we aim to make engineering R&D more accessible by enabling seamless communication between natural and engineering languages, bringing advanced technologies to more creators."
Flexible Manufacturing Takes Center Stage: Tailored Solutions for Global Enterprises
P&R Measurement's flexible manufacturing solutions are also captivating audiences at CES 2025. The company provides customized solutions for automated testing and assembly lines to improve precision, reliability, and efficiency in production.
A standout innovation is its Smart Lab, an automated laboratory platform powered by AI and IoT. Designed to accelerate product development, Smart Lab reduced energy consumption in high-energy labs by 30% in its collaboration with a leading home appliance manufacturer, lowered the client's R&D testing costs, and significantly improved testing efficiency for home appliance development.
Additionally, P&R Measurement is showcasing A²S Lab, a state-of-the-art sensory testing solution, and A²TP, a versatile flexible testing platform. Both innovations accelerate complex testing and verification processes, enhancing efficiency and user experience.
Cross-Industry Collaboration and Recognition
P&R Measurement leverages its expertise across AI, information technology, industrial manufacturing, measurement and testing to deliver innovative solutions for clients in consumer electronics, home appliances, and automotive sectors.
In partnership with a leading automotive manufacturer, P&R Measurement delivered a visual defect detection solution powered by AI algorithms. By training detection models, this solution enabled reliable appearance defect detection for large automotive parts, achieving pass rate exceeding 99.8%.
For a global consumer electronics company, P&R Measurement utilized AI deep learning-based discriminative models to map objective test data to psychoacoustics signals, minimizing interference factors on the production line and automating laboratory-level testing directly on the production lines with efficient sound anomaly detection.
These revolutionary innovations have successfully addressed critical challenges in on-time delivery, earning P&R Measurement widespread market recognition.
Data-Driven Innovation: P&R Measurement's Vision for the Future
By prioritizing customer needs, P&R Measurement drives the transformation of intelligent manufacturing. The company remains committed to integrating AI and advanced testing, measurement, and control technologies into both industrial and everyday applications. Its flexible solution enhances the flexibility and adaptability of production systems, enabling quick response to evolving market demands. This customer-centric approach has earned P&R Measurement widespread trust and praise from its clients.
Following CES 2025, P&R Measurement is set to showcase cutting-edge products and forward-looking concepts at DesignCon2025 on January 28, further solidifying its leadership in redefining the future of global industrial ecosystems.
For more information, visit the P&R Measurement website at
https://prmeasure.com/
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P&R Measurement Debuts at CES 2025: Redefining AI Industrial Applications and Flexible Manufacturing
Completely Upgraded Servers with the New Intel® Xeon® 6900 Series Processors with P-Cores Optimized for Maximum Performance are Now Shipping in Volume, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and the Industry's Leading Direct-to-Chip Liquid Cooling Solutions
SAN JOSE, Calif., Jan. 9, 2025 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.
"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions® design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."
Click here for more information.
There are currently several X14 systems available to customers for remote testing and validation via Supermicro's JumpStart program.
The Supermicro X14 systems are available in a variety of form factors, each optimized for a range of performance-intensive workloads:
These models leverage shared components to increase efficiency and can be fitted with direct-to-chip liquid cooling for maximum performance density.
Supermicro's max-performance X14 systems support the Intel Xeon 6900 series processors with P-cores, which feature up to 128 performance cores per CPU, support for high bandwidth MRDIMMs up to 8800 MT/s, and built-in accelerators including the AI-specific Intel AMX.
The X14 systems represent the perfect building blocks for data centers at any scale, with Supermicro able to provide complete rack-level integration services including design, building, testing, validation, and delivery. An industry-leading global manufacturing capacity of up to 5,000 racks per month (2,000 liquid cooled) and extensive testing and burn-in facilities allow Supermicro to deliver solutions at any scale in a matter of weeks, not months. With Supermicro's complete in-house liquid-cooled direct-to-chip cold plate solutions, liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments. These turn-key solutions include the rack, cabling, power, and cooling infrastructure to simplify solution deployment at scale.
To maximize the performance and density potential of the latest X14 systems, Supermicro also offers complete in-house developed liquid cooling solutions including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments.
Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include:
GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis or edge-optimized 3U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads.
Intel® Gaudi® 3 AI Accelerators – Supermicro is now shipping the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. Designed to increase the efficiency and lower the cost of large-scale AI model training and AI inferencing, the system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs.
SuperBlade® – Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.
FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node.
Hyper – X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads